Hologenix 200mm and 300mm Automated Edge Batch Defect Detection
Automatically detect mid & large sized defects (diameter larger than 100um) such as Cracks, Chips, Scratches and Particles at the wafer edge.
All wafers in the cassette are inspected simultaneously.
An entire cassette of wafers can be inspected in 60 seconds (200mm wafers).
Images of the defects are automatically stored on the PC.
The standard system provides for manual placement of the cassette(s) on the tool.
Various options include: Automatic Cassette Load and Unload, Bar Code Reader, Fan Filter Unit with HEPA-ULPA, and Host communication.
Additional configurations include: 150mm and 100mm sizes.
Technical Specifications (PDF)