Layer Thickness, Planarity, Bumps, TSV, MEMS, and Roughness Measurements.

Layer Thickness, Planarity, Bumps, TSV, MEMS, and Roughness Measurements.

SemDex 101

SemDex 101
Compact tabletop manual loading system ideal for off-line process monitoring for 50mm to 100mm substrates.

SemDex 301
Manual loading, automated in-line process monitoring system for 150mm, 200mm & 300mm substrates.

Contactless, fast and precise process control. Based on patented Spectral Coherence Interferometry technology (SCI).